Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
1～10 item / All 10 items
Ideal for soldering high-density printed circuit boards of electronic devices that require high reliability.
High-performance solder with excellent non-cleaning type wetting, spreading, and solder joint reliability.
![*Comprehensive Catalog Giveaway [Solder with a Rich Lineup of Flux]*](https://image.mono.ipros.com/public/product/image/12b/2000302495/IPROS6413314804793904497.PNG?w=280&h=280)
Introducing some of our solder with resin! All halogens are additive-free! *The downloadable catalog will be the comprehensive catalog!
The "EVSOL HFC Series" is a completely halogen-free solder with resin. It complies with all current halogen-free standards. It uses special activators other than halogens to ensure wettability equivalent to halogen-containing products. It also demonstrates good wettability for nickel and brass, enabling soldering of a wider variety of components. 【Features】 ■ Completely halogen-free ■ Ensures wettability ■ Compatible with difficult substrates *For more details, please refer to the catalog or feel free to contact us.
Suitable for soldering multi-pin components and point soldering of through holes.
"SR-HS" is a solder that supports through-hole soldering and allows for high-speed and stable soldering. When soldering to through-hole PCBs, it ensures stable wetting on the back side of the land. Additionally, the spread of flux residue is stable, suppressing interference from flux residue around the soldered area. [Features] ■ Enables high-speed and stable soldering ■ Suppresses flux scattering ■ Compatible with alloys that prevent solder tip erosion *For more details, please download the PDF or feel free to contact us.
No splattering solder!
"Shell-RC" is a resin-filled solder that minimizes the scattering of flux and solder to the utmost limit. With 100% (※) non-splashing resin-filled solder, we achieve "stable soldering" and "production efficiency" for your products. ※ Based on our research results. 【Mechanism】 1. During V-groove processing, the pressure of the cutter slightly flattens the solder wire, making it oval. 2. To return the oval shape to a circle and to suppress the moisture absorption of the flux, the V-groove is closed. 3. To prevent moisture absorption from the gap created by closing the V-groove, a moisture-proof agent is coated. ※ This has the effect of suppressing the oxidation of the metal surface of the resin-filled solder, resulting in stable and rapid melting of the resin-filled solder. ※ For more details, please feel free to contact us.
We will introduce knowledge and techniques related to soldering defects, such as material selection.
Wet defects, bridging, and solder spikes are all issues caused by the active agents in the flux. During soldering, the active agents decompose and volatilize due to heat, leading to depletion. When depleted, defects such as wetting issues, bridging, and solder spikes occur, so it is possible to prevent these defects by continuously supplying fresh active agents to the soldering area. By supplying small amounts to the soldering area, fresh active agents are always present, achieving good wetting. This is particularly important in robotic soldering, where the final results can vary significantly. Additionally, reviewing issues such as excessively high soldering iron temperatures, insufficient heater capacity, and mismatched dimensions between components and the soldering tip is also effective. We offer flux-containing solder that demonstrates excellent wetting properties across a wide temperature range and for various mounted components. Please contact us through our website for samples. 【Overview】 ■ Review of soldering operations - Achieving good wetting by supplying small amounts - Reviewing issues such as excessively high soldering iron temperatures, insufficient heater capacity, and mismatched dimensions between components and the soldering tip is also effective - Using flux-containing solder with a wide temperature range and sustained activity to prevent defects.
We will introduce knowledge and techniques related to soldering defects, such as the causes of flux scattering.
One of the common issues during work with rosin-containing solder is flux scattering. In addition to damaging the appearance of the product, flux that adheres to the LCD screen, camera unit, and switch contacts can lead to product malfunctions. Flux scattering occurs when low-boiling and low-decomposition components in the flux boil and gasify due to the heat during soldering, resulting in an explosion simultaneous with solder melting. Factors that make scattering more likely include: - Not selecting solder appropriate for the task. - The soldering iron temperature being too high. - The speed of solder feeding being too fast. - The working location being at a high altitude (low surrounding air pressure). Solder balls are also likely to occur simultaneously with flux scattering. They can arise when solder is fed too rapidly, as well as when the movement of the soldering iron is too vigorous or when there is too much solder. Measures such as increasing the melting viscosity of the flux and using materials with less gasification can help reduce scattering caused by solder materials. Our company offers rosin-containing solder and solder paste with scattering countermeasures. For samples, please contact us through our website below.
We will introduce knowledge and techniques related to soldering defects, including issues and countermeasures for residue cracking.
Residue cracking is a phenomenon that occurs when physical forces such as thermal contraction and bending are applied to flux residue, leading to cracking and delamination. When cracks occur in the residue, phenomena such as moisture absorption at the crack site can arise, resulting in decreased electrical reliability. Additionally, if delaminated flux enters switch contacts, it can cause operational failures. Countermeasures for residue cracking include cleaning the substrate and applying coatings; however, both of these options incur additional costs. Therefore, it is recommended to use solder and solder paste that do not crack under residue. Our company offers solder and solder paste that address residue cracking issues. Please contact us through our website for samples. 【Overview】 ■Issues with residue cracking - Phenomena such as moisture absorption at the crack site lead to decreased electrical reliability. - Delaminated flux entering switch contacts can cause operational failures. - Countermeasures for residue cracking include cleaning the substrate and applying coatings after soldering, but both incur costs. - Using solder and solder paste that do not crack under residue can resolve issues caused by residue cracking.
Halogen-free standard compliant! Significantly reduced scattering, enabling high-quality mounting! Demonstrates sufficient wettability even at low output, reducing damage to mounted components due to heat.
Our "Solder with Flux (EYP Series)" focuses on wetting and does not contain Cl and Br, which are causes of dioxin generation, making it compliant with most halogen-free standards. We select materials suitable for rapid heating by light, ensuring sufficient wettability even at low power, thereby reducing damage to mounted components due to heat. We choose base materials in accordance with the rapid heating and the melting point rise of the solder alloy, enabling high-quality mounting with minimal scattering.
